? semiconductor components industries, llc, 2007 february, 2007 ? rev. 11 1 publication order number: mc74hc1g08/d mc74hc1g08 single 2?input and gate the mc74hc1g08 is a high speed cmos 2?input and gate fabricated with silicon gate cmos technology. the internal circuit is composed of multiple stages, including a buffer output which provides high noise immunity and stable output. the mc74hc1g08 output drive current is 1/2 compared to mc74hc series. features ? high speed: t pd = 7 ns (typ) at v cc = 5 v ? low power dissipation: i cc = 1 a (max) at t a = 25 c ? high noise immunity ? balanced propagation delays (t plh = t phl ) ? symmetrical output impedance (i oh = i ol = 2 ma) ? chip complexity: fet = 44 ? pb?free packages are available figure 1. pinout figure 2. logic symbol in a in b out y & v cc in b in a out y gnd 1 2 34 5 l l h h l h l h function table inputs output ab l l l h y see detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. ordering information pin assignment 1 2 3 gnd in b in a 4 5v cc out y http://onsemi.com marking diagrams h2 = device code m = date code* = pb?free package sc?88a / sot?353 / sc?70 df suffix case 419a tsop?5 / sot?23 / sc?59 dt suffix case 483 h2 m 1 5 h2 m m 1 5 (note: microdot may be in either location) *date code orientation and/or position may vary depending upon manufacturing location.
mc74hc1g08 http://onsemi.com 2 maximum ratings symbol parameter value unit v cc dc supply voltage 0.5 to 7.0 v v in dc input voltage 0.5 to v cc 0.5 v v out dc output voltage 0.5 to v cc 0.5 v i ik dc input diode current 20 ma i ok dc output diode current 20 ma i out dc output sink current 12.5 ma i cc dc supply current per supply pin 25 ma t stg storage temperature range 65 to 150 c t l lead temperature, 1 mm from case for 10 seconds 260 c t j junction temperature under bias 150 c ja thermal resistance sc70?5/sc?88a/sot?353 (note 1) sot23?5/tsop?5/sc59?5 350 230 c/w p d power dissipation in still air at 85 c sc70?5/sc?88a/sot?353 sot23?5/tsop?5/sc59?5 150 200 mw msl moisture sensitivity level 1 f r flammability rating oxygen index: 28 to 34 ul 94 v?0 @ 0.125 in v esd esd withstand voltage human body model (note 2) machine model (note 3) charged device model (note 4) 2000 200 n/a v i latchup latchup performance above v cc and below gnd at 125 c (note 5) 500 ma stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. measured with minimum pad spacing on an fr4 board, using 10 mm?by?1 inch, 20 ounce copper trace with no air flow. 2. tested to eia/jesd22?a114?a. 3. tested to eia/jesd22?a115?a. 4. tested to jesd22?c101?a. 5. tested to eia/jesd78. recommended operating conditions symbol parameter min max unit v cc dc supply voltage 2.0 6.0 v v in dc input voltage 0.0 v cc v v out dc output voltage 0.0 v cc v t a operating temperature range 55 125 c t r , t f input rise and fall time v cc = 2.0 v v cc = 3.0 v v cc = 4.5 v v cc = 6.0 v 0 0 0 0 1000 600 500 400 ns device junction temperature versus time to 0.1% bond failures junction temperature c time, hours time, years 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 1 1 10 100 1000 failure rate of plastic = ceramic until intermetallics occur figure 3. failure rate vs. time junction temperature normalized failure rate time, years t j = 130 c t j = 120 c t j = 110 c t j = 100 c t j = 90 c t j = 80 c
mc74hc1g08 http://onsemi.com 3 dc electrical characteristics v cc t a = 25 c t a 85 c 55 c t a 125 c symbol parameter test conditions (v) min typ max min max min max unit v ih minimum high?level input voltage 2.0 3.0 4.5 6.0 1.5 2.1 3.15 4.20 1.5 2.1 3.15 4.20 1.5 2.1 3.15 4.20 v v il maximum low?level input voltage 2.0 3.0 4.5 6.0 0.5 0.9 1.35 1.80 0.5 0.9 1.35 1.80 0.5 0.9 1.35 1.80 v v oh minimum high?level output voltage v in = v ih or v il v in = v ih or v il i oh = ?20 a 2.0 3.0 4.5 6.0 1.9 2.9 4.4 5.9 2.0 3.0 4.5 6.0 1.9 2.9 4.4 5.9 1.9 2.9 4.4 5.9 v v in = v ih or v il i oh = ?2 ma i oh = ?2.6 ma 4.5 6.0 4.18 5.68 4.31 5.80 4.13 5.63 4.08 5.58 v ol maximum low?level output voltage v in = v ih or v il v in = v ih or v il i ol = 20 a 2.0 3.0 4.5 6.0 0.0 0.0 0.0 0.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 v v in = v ih or v il i ol = 2 ma i ol = 2.6 ma 4.5 6.0 0.17 0.18 0.26 0.26 0.33 0.33 0.40 0.40 i in maximum input leakage current v in = 6.0 v or gnd 6.0 0.1 1.0 1.0 a i cc maximum quiescent supply current v in = v cc or gnd 6.0 1.0 10 40 a ac electrical characteristics (input t r = t f = 6.0 ns) t a = 25 c t a 85 c 55 c t a 125 c symbol parameter test conditions min typ max min max min max unit ???? ? ?? ? ? ?? ? ? ?? ? ???? t plh , t phl ??????? ? ????? ? ? ????? ? ? ????? ? ??????? maximum propagation delay, input a or b to y ???????? ???????? ??? ??? ??? ??? ?? ?? ??? ??? ??? ??? ???? ???? ???? ???? ?? ?? ???????? ? ?????? ? ? ?????? ? ???????? v cc = 2.0 v c l = 50 pf v cc = 3.0 v v cc = 4.5 v v cc = 6.0 v ??? ? ? ? ? ? ? ??? ??? ? ? ? ? ? ? ??? 20 11 8 7 ?? ?? ?? ?? ??? ? ? ? ? ? ? ??? ??? ? ? ? ? ? ? ??? 125 35 25 21 ???? ? ?? ? ? ?? ? ???? ???? ? ?? ? ? ?? ? ???? 155 90 35 26 ?? ?? ?? ?? ???? ? ?? ? ? ?? ? ???? t tlh , t thl ??????? ? ????? ? ? ????? ? ??????? output transition time ???????? ???????? ??? ??? ??? ??? ?? ?? ??? ??? ??? ??? ???? ???? ???? ???? ?? ?? ???????? ? ?????? ? ???????? v cc = 2.0 v c l = 50 pf v cc = 3.0 v v cc = 4.5 v v cc = 6.0 v ??? ? ? ? ??? ??? ? ? ? ??? 25 16 11 9 ?? ?? ?? ??? ? ? ? ??? ??? ? ? ? ??? 155 45 31 26 ???? ? ?? ? ???? ???? ? ?? ? ???? 200 60 38 32 ?? ?? ?? ???? ? ?? ? ???? c in ??????? ? ????? ? ??????? maximum input capacitance ???????? ? ?????? ? ???????? ??? ? ? ? ??? ??? ? ? ? ??? 5 ?? ?? ?? ??? ? ? ? ??? ??? ? ? ? ??? 10 ???? ? ?? ? ???? ???? ? ?? ? ???? 10 ?? ?? ?? typical @ 25 c, v cc = 5.0 v c pd power dissipation capacitance (note 6) 10 pf 6. c pd is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption with out load. average operating current can be obtained by the equation: i cc(opr ) = c pd v cc f in + i cc . c pd is used to determine the no?load dynamic power consumption; p d = c pd v cc 2 f in + i cc v cc .
mc74hc1g08 http://onsemi.com 4 *includes all probe and jig capacitance. a 1?mhz square input wave is recommended for propagation delay tests. figure 4. switching waveforms figure 5. test circuit c l* input v cc output v cc gnd 50% 50% input a or b output y t phl t plh 90% 10% 90% 10% t tlh t thl t r t f ordering information device package shipping ? MC74HC1G08DFT1 sc70?5/sc?88a/sot?353 3000 / tape & reel MC74HC1G08DFT1g sc70?5/sc?88a/sot?353 (pb?free) mc74hc1g08dft2 sc70?5/sc?88a/sot?353 mc74hc1g08dft2g sc70?5/sc?88a/sot?353 (pb?free) mc74hc1g08dtt1 sot23?5/tsop?5/sc59?5 mc74hc1g08dtt1g sot23?5/tsop?5/sc59?5 (pb?free) ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
mc74hc1g08 http://onsemi.com 5 package dimensions notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 419a?01 obsolete. new standard 419a?02. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. dim a min max min max millimeters 1.80 2.20 0.071 0.087 inches b 1.15 1.35 0.045 0.053 c 0.80 1.10 0.031 0.043 d 0.10 0.30 0.004 0.012 g 0.65 bsc 0.026 bsc h ??? 0.10 ??? 0.004 j 0.10 0.25 0.004 0.010 k 0.10 0.30 0.004 0.012 n 0.20 ref 0.008 ref s 2.00 2.20 0.079 0.087 b 0.2 (0.008) mm 12 3 4 5 a g s d 5 pl h c n j k ?b? sc?88a, sot?353, sc?70 case 419a?02 issue j mm inches scale 20:1 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 0.65 0.025 0.65 0.025 0.50 0.0197 0.40 0.0157 1.9 0.0748
mc74hc1g08 http://onsemi.com 6 package dimensions tsop?5 case 483?02 issue g notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. 5. optional construction: an additional trimmed lead is allowed in this location. trimmed lead not to extend more than 0.2 from body. dim min max millimeters a 3.00 bsc b 1.50 bsc c 0.90 1.10 d 0.25 0.50 g 0.95 bsc h 0.01 0.10 j 0.10 0.26 k 0.20 0.60 l 1.25 1.55 m 0 10 s 2.50 3.00 123 54 s a g l b d h c j 0.7 0.028 1.0 0.039 mm inches scale 10:1 0.95 0.037 2.4 0.094 1.9 0.074 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 0.20 5x c ab t 0.10 2x 2x t 0.20 note 5 t seating plane 0.05 k m detail z detail z on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, r epresentation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5773?3850 mc74hc1g08/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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